d d 2 2 8 8 m m m m t t o o p p s s 6 6 p p o o w w e e r r w w a a r r m m w w h h i i t t e e c c o o b b l l e e d d o o s s m m 5 5 x x 3 3 l l 6 6 e e 1 1 e e ver.a.2 features outline dimension high-power led long lifetime operation typical viewing angle : 140deg rohs compliant possible to attach to heat sink directly without using print circuit board. applications indoor & outdoor lighting light bulb reading lamps display cases, furniture illumination, marker architectural illumination spotlights anode unit:mm tolerance:0.30mm tolerances are for reference only cathode absolute maximum rating (ta=25) (ta=25) (ta=25) (ta=25) directivity item symbol value unit dc forward current *1 i f 700 ma pulse forward current*2 i fp 1200 ma reverse voltage v r 15 v power dissipation*1 p d 8,400 mw operating temperature topr -30 ~ +85 storage temperature tstg -40~ +100 lead soldering temperature tsol 260 /5sec - *1, power dissipation and forward current are the v alue when the module temperature is set lower than the rating by using an adequate heat sink. *2, pulse width max.10ms duty ratio max 1/10 30 90 60 0 0 90 30 60 0.5 0.5 1 1 electrical -optical characteristics (ta=25 (ta=25 (ta=25 (ta=25 ) )) ) item symbol condition min. typ. max. unit dc forward voltage v f i f =600ma 9.6 10.2 12.0 v dc reverse current i r v r =15v - - 20 a luminous flux v i f =600ma 370 400 - lm color temperature cct i f =600ma 2700 3000 3300 k x i f = 600ma - 0.44 - chromaticity coordinates* y i f =600ma - 0.41 - 50% power angle 2 1/2 i f =600ma - 140 - deg note: don?t drive at rated current more than 5s wit hout heat sink for high power series . * tolerance of chromaticity coordinates is + 10% , * tolerance of luminous flux is + 20% led & application technologies
d d 2 2 8 8 m m m m t t o o p p s s 6 6 p p o o w w e e r r w w a a r r m m w w h h i i t t e e c c o o b b l l e e d d o o s s m m 5 5 x x 3 3 l l 6 6 e e 1 1 e e ver . a.2 heat design the following pictures show some measurements of mo unted 5w led on the heat sink for each board a and b (see fig 1) with using thermograph to make an observation about heat distribution. each boards is tested at various cur rent conditions. as a result, led needs larger heat sink as much as possible to reduce its own case temperature. fig. 1 configuration pattern examples for board assembly board led power material surface area (m O OO O ) min. a 5w al 20,600 b 10w al 41,200 c 25w al 103,000 d 50w al 206,000 e 100w al 412,000 f 200w al 824,000 g 300w al 1236,000 above tested led device is attached with adhesive s heet to the heatsink. for reference's sake, tj absolute maximum rating is defined at 115 as a prerequisite on design process of 5w led. board a (surface area=10,300m O OO O ) board b (surface area=20,600m O OO O ) if=600ma if =600ma led & application technologies
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